GPU pods, tensor ASICs, high‑bandwidth memory, and interconnects.
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XCENA ran two live demonstrations at OCP, each aimed at a distinct pain point in large-scale AI inference. MX1 is a CXL 3.2 Type 3 device. That classification matters: a Type 3 CXL device exposes its attached memory to the host CPU as byte-addressable…
The artificial intelligence boom continues to put pressure on the hardware supply chain at unexpected levels. With data centers demanding huge computing power, high-bandwidth y (HBM) has become one of the most sought-after parts in the market. In this situation,…
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Nvidia has asked Samsung. Hynix and Micron to use base dies made on TSMC’s 3nm node for its custom HBM called NVHBM (pictured), reports the Seoul Economic Daily. The base dies in HBM contain the logic layer at the bottom of…
Rising memory prices and tightening supply are reportedly pushing some Chinese smartphone makers to turn to salvaged chips. According to TechNews, som... TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed…
As previously reported by ZDNet in September, Samsung is pursuing a dual-track strategy for custom HBM, tapping both its own foundry and rival TSMC for base die production. A new report from Seoul Economic Daily lends further weight to this…
In reltion with: memory, production, Samsung Samsung could reduce Galaxy smartphone production by as much as 30% in the fourth quarter of 2026, according to a report, as higher memory prices threaten margins for lower-profit handsets. The potential cut comes while the…
I just ordered a new tablet to replace my four year old one that started eating drives. I did not order a SSD since they are usually extremely overpriced from the factory. I do have some questions about drive specs,…
Samsung is reportedly adopting TSMC’s 3nm process for Nvidia’s next-generation HBM base dies, marking a potential shift in its memory chip manufacturing strategy. Samsung will use TSMC’s 3nm process to produce base dies for Nvidia’s next-generation custom high-bandwidth memory (HBM) chips, according…
SEOUL, Oct 18 (Reuters) – Samsung Electronics will use TSMC’s 3-nanometre process to produce base dies for Nvidia’s next-generation custom high-bandwidth memory (HBM) chips, the Seoul Economic Daily reported on Sunday. The move would mark the first time Samsung has worked with…